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? 2003 microchip technology inc. ds21421c-page 1 m TC4423/tc4424/tc4425 features ? high peak output current: 3a ? wide input supply voltage operating range: - 4.5v to 18v ? high capacitive load drive capab ility: 1800 pf in 25 nsec ? short delay times: <40 nsec (typ) ? matched rise/fall times ? low supply current: - with logic ? 1 ? input ? 3.5 ma (max) - with logic ? 0 ? input ? 350 a (max) ? low output impedance: 3.5 ? (typ) ? latch-up protected: will withstand 1.5a reverse current ? logic input will withstand negative swing up to 5v ? esd protected: 4 kv ? pin compatible with the tc1426/tc1427/tc1428, tc4426/tc4427/tc4428 and tc4426a/ tc4427a/tc4428a devices. applications ? switch mode power supplies ? pulse transformer drive ? line drivers general description the TC4423/tc4424/tc4425 devices are a family of 3a, dual output buffers/mosfet drivers. pin compatible with both the tc4426/4427/4428 and tc426/427/428 families (dual 1.5a drivers), the TC4423/tc4424/tc4425 family has an increased latch-up current rating of 1.5a, making them even more robust for operation in harsh electrical environments. as mosfet drivers, the TC4423/tc4424/tc4425 can easily charge 1800 pf gate capacitance in under 35 nsec and provide low enough impedances in both the on and off states to ensure the mosfet's intended state will not be affected, even by large transients. the TC4423/tc4424/tc4425 inputs may be driven directly from either ttl or cmos (2.4v to 18v). in addition, 300 mv of hysteresis is built-in to provide noise immunity and to allow the device to be driven from slowly rising or falling waveforms. package types 8-pin pdip/cerdip 1 2 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd nc out a out b v dd nc out a out b v dd TC4423 tc4424 tc4425 TC4423 tc4424 tc4425 1 2 3 4 5 6 7 8 16 13 12 11 10 9 nc in a nc gnd gnd nc in b nc nc out a v dd v dd out b out b nc out a 15 14 TC4423 tc4424 tc4425 16-pin soic (wide) note: duplicate pins must be connected for proper nc = no connection nc out a v dd v dd out b out b nc out a out a v dd v dd out b out b nc out a TC4423 tc4424 tc4425 operation. nc 3a dual high-speed power mosfet drivers
TC4423/tc4424/tc4425 ds21421c-page 2 ? 2003 microchip technology inc. functional block diagram effective input c = 20 pf (each input) TC4423 dual inverting tc4424 dual non-inverting tc4425 one inverting, one non-inverting output input gnd v dd 300 mv 4.7v inverting non-inverting note 1: unused inputs should be grounded.
? 2003 microchip technology inc. ds21421c-page 3 TC4423/tc4424/tc4425 1.0 electrical characteristics absolute maximum ratings* supply voltage ................................................................+22v input voltage, in a or in b ............................................ (v dd + 0.3v) to (gnd ? 5v) package power dissipation (t a 70c) pdip...................................................................730 mw cerdip .............................................................800 mw soic ..................................................................470 mw * notice: stresses above those listed under "maximum ratings" may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise indicated, t a = +25c, with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v logic ? 0 ?, low input voltage v il ??0.8v input current i in -1 ? 1 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ??v low output voltage v ol ? ? 0.025 v output resistance, high r oh ?2.85 ? i out = 10 ma, v dd = 18v output resistance, low r ol ?3.55 ? i out = 10 ma, v dd = 18v peak output current i pk ?3?a latch-up protection withstand reverse current i rev ? >1.5 ? a duty cycle 2%, t 300 sec. switching time (note 1) rise time t r ?2335nsec figure 4-1 , figure 4-2 , c l = 1800 pf fall time t f ?2535nsec figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d1 ?3375nsec figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d2 ?3875nsec figure 4-1 , figure 4-2 , c l = 1800 pf power supply power supply current i s ? ? 1.5 0.15 2.5 0.25 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design.
TC4423/tc4424/tc4425 ds21421c-page 4 ? 2003 microchip technology inc. dc characteristics (over operating temperature range) temperature characteristics electrical specifications: unless otherwise indicated, operating temperature range with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v logic ? 0 ?, low input voltage v il ??0.8v input current i in -10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v low output voltage v ol ??0.025v output resistance, high r oh ?3.78 ? i out = 10 ma, v dd = 18v output resistance, low r ol ?4.38 ? i out = 10 ma, v dd = 18v peak output current i pk ?3.0?a latch-up protection withstand reverse current i rev ? >1.5 ? a duty cycle 2%, t 300 sec switching time (note 1) rise time t r ?2860nsec figure 4-1 , figure 4-2 , c l = 1800 pf fall time t f ?3260nsec figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d1 ? 32 100 nsec figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d2 ? 38 100 nsec figure 4-1 , figure 4-2 , c l = 1800 pf power supply power supply current i s ? ? 2.0 0.2 3.5 0.3 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0?+70oc specified temperature range (e) t a -40 ? +85 oc specified temperature range (m) t a -55 ? +125 oc specified temperature range (v) t a -40 ? +125 oc maximum junction temperature t j ? ? +150 oc storage temperature range t a -65 ? +150 oc package thermal resistances thermal resistance, 8l-pdip ja ? 125 ? oc/w thermal resistance, 8l-cerdip ja ? 150 ? oc/w thermal resistance, 16l-soic ja ? 155 ? oc/w
? 2003 microchip technology inc. ds21421c-page 5 TC4423/tc4424/tc4425 2.0 typical performance curves figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: rise and fall times vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: propagation delay vs. input amplitude. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 4681012141618 2200pf 100 80 60 40 20 0 1000pf 3300pf 1500pf 4700pf 470pf t rise (nsec) v dd (v) 100 1000 10,000 5v 10v 15v 100 80 60 40 20 0 t rise (nsec) c load (pf) time (nsec) 32 30 28 26 24 22 20 18 -55 -35 5 25 45 65 85 105 125 -15 t fall t rise t a ( c) t fall t rise c load = 2200pf 4681012141618 100 80 60 40 20 0 1000pf 1500pf 4700pf 3300pf 2200pf 470pf t fall (nsec) v dd (v) 100 1000 10,000 5v 10v 15v 100 80 60 40 20 0 t fall (nsec) c load (pf) 100 80 60 40 20 delay time (nsec) input (v) 0123456789101112 t d1 t d2 c load = 2200pf v dd = 10v
TC4423/tc4424/tc4425 ds21421c-page 6 ? 2003 microchip technology inc. typical performance curves (continued) figure 2-7: propagation delay time vs. supply voltage. figure 2-8: quiescent current vs. supply voltage. figure 2-9: output resistance (output high) vs. supply voltage. figure 2-10: propagation delay time vs. temperature. figure 2-11: quiescent current vs. temperature. figure 2-12: output resistance (output low) vs. supply voltage. 50 45 40 35 30 25 20 4 6 8 1012141618 delay time (nsec) v dd (v) c load = 2200pf t d1 t d2 1 0.1 0.01 4 6 8 10 12 14 16 18 both inputs = 1 both inputs = 0 v dd (v) i quiescent (ma) t a = 25 c 14 12 10 8 6 4 2 4 6 8 10 12 14 16 18 typ @ t a = +25 c worst case @ t j = +150 c v dd (v) r ds(on) ( ? ) 50 45 40 35 30 25 20 delay time (nsec) -55 -35 -15 5 25 45 65 85 105 125 t d2 t d1 c load = 2200pf t a ( c) -55 -35 -15 5 25 45 65 85 105 125 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 both inputs = 1 both inputs = 0 t a ( c) i quiescent (ma) 14 12 10 8 6 4 2 4 6 8 10121416 18 worst case @ t j = +150 c v dd (v) typ @ t a = +25 c r ds(on) ( ? )
? 2003 microchip technology inc. ds21421c-page 7 TC4423/tc4424/tc4425 typical performance curves (continued) note : load on single output only figure 2-13: supply current vs. capacitive load. figure 2-14: supply current vs. capacitive load. figure 2-15: supply current vs. capacitive load. figure 2-16: supply current vs. frequency. figure 2-17: supply current vs. frequency. figure 2-18: supply current vs. frequency. 100 1000 10,000 60 50 40 30 20 10 0 355khz 200khz 35.5khz 634khz c load (pf) 112.5khz 20khz 63.4khz v dd = 18v i supply (ma) 100 1000 10,000 2mhz 1.125mhz 634khz 355khz 200khz 112.5khz 63.4khz 20khz 90 80 70 60 50 40 30 20 10 0 i supply (ma) c load (pf) v dd = 12v 100 1000 10,000 634khz 355khz 112.5khz 20khz 2mhz 1.125mhz 3.55mhz 120 100 80 60 40 20 0 c load (pf) i supply (ma) v dd = 6v 10,000pf frequency (khz) 60 50 40 30 20 10 0 10 100 1000 3300pf 100pf 1000pf i supply (ma) v dd = 18v 10,000pf 10 100 1000 frequency ( khz ) 90 80 70 60 50 40 30 20 10 0 100pf 3300pf 1000pf i supply (ma) v dd = 12v 10 100 1000 frequency (khz) 1000pf 4700pf 100pf 120 100 80 60 40 20 0 10,000pf 2200pf i supply (ma) v dd = 6v
TC4423/tc4424/tc4425 ds21421c-page 8 ? 2003 microchip technology inc. typical performance curves (continued) figure 2-19: TC4423 crossover energy. 10 -8 8 10 -7 a sec 024681012141618 6 4 2 8 6 4 2 10 -9 v in (v) note: the values on this graph represent the loss seen by both drivers in a package during one complete cycle. for a single driver, divide the stated values by 2. for a single transition of a single driver, divide the stated value by 4.
? 2003 microchip technology inc. ds21421c-page 9 TC4423/tc4424/tc4425 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 input a input a is a ttl/cmos-compatible input that controls output a. this input has 300 mv of hysteresis between the high and low input levels that allows it to be driven from slow rising and falling signals and provide noise immunity. 3.2 input b input b is a ttl/cmos-compatible input that controls output b. this input has 300 mv of hysteresis between the high and low input levels that allows it to be driven from slow rising and falling signals and provide noise immunity. 3.3 output b output b is a cmos push-pull output that is capable of sourcing and sinking 3a peaks of current (v dd = 18v). the low output impedance ensures the gate of the external mosfet will stay in the intended state even during large transients. this output also has a reverse current latch-up rating of 1.5a. 3.4 output a output a is a cmos push-pull output that is capable of sourcing and sinking 3a peaks of current (v dd = 18v). the low output impedance ensures the gate of the external mosfet will stay in the intended state even during large transients. this output also has a reverse current latch-up rating of 1.5a. 3.5 supply input (v dd ) v dd is the bias supply input for the mosfet driver and has a voltage range of 4.5v to 18v. this input must be decoupled to ground with a local ceramic capacitor. this bypass capacitor provides a localized low- impedance path for the peak currents that are to be provided to the load. 3.6 ground (gnd) ground is the device return pin. the ground pin(s) should have a low-impedance connection to the bias supply source return. high peak currents will flow out the ground pin(s) when the capacitive load is being discharged. 8-pin pdip, cerdip 16-pin soic (wide) symbol description 1 1 nc no connect 2 2 in a input a ? 3 nc no connect 3 4 gnd ground ? 5 gnd ground ? 6 nc no connect 4 7 in b input b ? 8 nc no connect ? 9 nc no connect 5 10 out b output b ? 11 out b output b 612v dd supply input ?13v dd supply input 7 14 out a output a ? 15 out a output a 8 16 nc no connect note 1: duplicate pins must be connected for proper operation.
TC4423/tc4424/tc4425 ds21421c-page 10 ? 2003 microchip technology inc. 4.0 applications information figure 4-1: inverting driver switching time. figure 4-2: non-inverting driver switching time. 0.1 f ceramic +5v 10% 90% 10% 90% 10% 90% 16v 1f wima mks-2 0v 0v TC4423 (1/2 tc4425) 1 2 c l = 1800 pf input input output t d1 t f t d2 input: 100 khz, square wave, output t r v dd = 16v t rise = t fall 10 nsec 90% input t d1 t f t d2 output t r 10% 10% 10% +5v 16v 0v 0v 90% 90% 0.1 f ceramic 1f wima mks-2 tc4424 (1/2 tc4425) 1 2 c l = 1800 pf input output input: 100 khz, square wave, v dd = 16v t rise = t fall 10 nsec
? 2003 microchip technology inc. ds21421c-page 11 TC4423/tc4424/tc4425 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead cerdip (300 mil) example: legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard marking consists of microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). for marking beyond this, certain price adders apply. please check with your microchip sales office. TC4423 cpa017 0210 xxxxxxxx xxxxxnnn yyww tc4424 mja017 0210 16-lead soic (300 mil) example: xxxxxxxxxxx xxxxxxxxxxx yywwnnn xxxxxxxxxxx 0210017 TC4423coe
TC4423/tc4424/tc4425 ds21421c-page 12 ? 2003 microchip technology inc. 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 8 8 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e.300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d.360 .373 .385 9.14 9.46 9.78 tip to seating plane l.125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b.014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 5 10 15 5 10 15 mold draft angle bottom 5 10 15 5 10 15 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
? 2003 microchip technology inc. ds21421c-page 13 TC4423/tc4424/tc4425 8-lead ceramic dual in-line ? 300 mil (cerdip) 10.16 9.15 8.13 .400 .360 .320 eb overall row spacing 0.51 0.46 0.41 .020 .018 .016 b lower lead width 1.65 1.40 1.14 .065 .055 .045 b1 upper lead width 0.38 0.29 0.20 .015 .012 .008 c lead thickness 5.08 4.13 3.18 .200 .163 .125 l tip to seating plane 10.16 9.78 9.40 .400 .385 .370 d overall length 7.62 6.73 5.84 .300 .265 .230 e1 ceramic pkg. width 8.13 7.75 7.37 .320 .305 .290 e shoulder to shoulder width 1.02 0.77 0.51 .040 .030 .020 a1 standoff 5.08 4.57 4.06 .200 .180 .160 a top to seating plane 2.54 .100 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units jedec equivalent: ms-030 drawing no. c04-010 *controlling parameter 1 2 d n e1 c eb e p l a2 b b1 a a1
TC4423/tc4424/tc4425 ds21421c-page 14 ? 2003 microchip technology inc. 16-lead plastic small outline (so) ? wide, 300 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.33 0.28 0.23 .013 .011 .009 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.74 0.50 0.25 .029 .020 .010 h chamfer distance 10.49 10.30 10.10 .413 .406 .398 d overall length 7.59 7.49 7.39 .299 .295 .291 e1 molded package width 10.67 10.34 10.01 .420 .407 .394 e overall width 0.30 0.20 0.10 .012 .008 .004 a1 standoff 2.39 2.31 2.24 .094 .091 .088 a2 molded package thickness 2.64 2.50 2.36 .104 .099 .093 a overall height 1.27 .050 p pitch 16 16 n number of pins max nom min max nom min dimension limits millimeters inches* units l c h 45 1 2 d p n b e1 e a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-013 drawing no. c04-102 significant characteristic
? 2003 microchip technology inc. ds21421c-page 15 TC4423/tc4424/tc4425 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . sales and support part no. x /xx package temperature range device device: TC4423: 3a dual mosfet driver, inverting tc4424: 3a dual mosfet driver, non-inverting tc4425: 3a dual mosfet driver, complementary temperature range: c = 0c to +70c e = -40c to +85c m = -55c to +125c (cerdip only) v = -40c to +125c package: pa = plastic dip, (300 mil body), 8-lead ja = ceramic dip, (300 mil body), 8-lead oe = soic (wide), 16-pin oe713 = soic (wide), 16-pin (tape and reel) examples: a) TC4423coe: commerical temperature, soic package. b) TC4423cpa: commercial temperature, pdip package. c) TC4423mja: military temperature, ceramic dip package. a) tc4424coe713: commerical temperature, soic package, tape and reel. b) tc4424epa: commercial temperature, pdip package. a) tc4425eoe: extended temperature, soic package. b) tc4425cpa: commercial temperature, pdip package. data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC4423/tc4424/tc4425 ds21421c-page 16 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds21421c-page 17 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , mplab, pic, picmicro, picstart, pro mate and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, micro id , mxdev, mxlab, picmaster, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. application maestro, dspicdem, dspicdem.net, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, powercal, powerinfo, powermate, powertool, rflab, rfpic, select mode, smartsensor, smartshunt, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2003, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification contained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchip's data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified.
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